By Robert A. Boudreau, Sharon M. Boudreau
Optical alignment is the costliest step in production micro-optical parts and fiber optics, yet the following members from businesses within the US, Europe, and Japan describe a brand new inexpensive process often called passive alignment, that's simply starting its migration from the laboratory bench to the creation line. They current numerous mechanical and optical equipment that let the micro-optics to be situated and sure with no need to strength the machine being synthetic. in addition they evaluate utilities for passive alignment. between particular issues are soldering know-how for opto-electronic packaging, a reasonably cheap plastic packaged module, and the Monte Carlo research of passive alignment equipment.
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Extra info for Passive Micro-Optical Alignment Methods
The viewer only observes the die in two dimensions, but for laser die, in particular, it is critical to set the height above the substrate. For this, both focal point and bump feeling techniques were explored, but bump feeling was the only approach not affected by chip thickness. These techniques rely on using a force gauge to sense contact with the surface to be bonded to, and then the machine backs off a set distance while the solder is melted. This type of visual passive alignment works best for alignment of large spot lasers, or die that feature mode expanders to bring the alignment tolerance into the 1 to 2-micron range for single-mode alignments.
An example of self-assembly by this approach was shown for the alignment of MEMS optics . In this system the solder was used to raise hinged plates up to a vertical position from their initial position flat on the substrate where they were formed. This enabled the passive alignment self-assembly of free-space optics such as lenses. In all cases, using solder this way, it is extremely important to make sure it is totally free flowing and not interfered with by oxidation or contamination. The most common self-alignment approach is to have an array of solder bumps on one plate and a corresponding array of wettable pads on another plate .
D. Stack, J. Mathews, C. S. Koehler, E. Johnson, and A. D. Kathman, “Integration of silicon bench with micro optics,” SPIE Conference on Photonic Packaging and Integration, SPIE, 3631 pp. 234–243 (1999). 33. H. Han, J. Mathews, J. Stack, and B. Hammond, “Packaging of integrated micro optical systems,” Lasers and Electro-Optics Society 1999 12th Annual meeting LEOS ’99. IEEE, San Francisco, Nov. 1999, pp. 90–91. 34. M. Feldman, H. Han, J. Stack, and J. Mathews, “Integrated micro-optical assemblies for optical interconnects,” Parallel Interconnects, Proceedings, 6th International Conference, Anchorage, AK, October, 1999, pp.