Microelectronics Packaging Handbook: Technology Drivers Part by R.R. Tummala, Visit Amazon's Eugene J. Rymaszewski Page,

By R.R. Tummala, Visit Amazon's Eugene J. Rymaszewski Page, search results, Learn about Author Central, Eugene J. Rymaszewski, , Visit Amazon's Alan G. Klopfenstein Page, search results, Learn about Author Central, Alan G. Klopfenstein,

Electronics has develop into the most important undefined, surpassing agriCUlture, automobile. and heavy steel industries. It has turn into the of selection for a rustic to prosper, already having given upward push to the outstanding prosperity of Japan. Korea. Singapore. Hong Kong. and eire between others. on the present progress fee, overall all over the world semiconductor revenues will achieve $300B through the 12 months 2000. the foremost digital applied sciences answerable for the expansion of the contain semiconductors. the packaging of semiconductors for structures use in car, telecom, laptop, client, aerospace, and scientific industries. screens. magnetic, and optical garage in addition to software program and approach applied sciences. there was a paradigm shift, despite the fact that, in those applied sciences. from mainframe and supercomputer purposes at any fee. to client functions at nearly one-tenth the associated fee and measurement. own desktops are an outstanding instance. going from $500IMIP whilst items have been first brought in 1981, to a projected $lIMIP inside 10 years. skinny. gentle transportable. consumer pleasant and extremely inexpensive are. for this reason. the attributes of tomorrow's computing and communications structures. digital packaging is outlined as interconnection. powering, cool­ ing, and conserving semiconductor chips for trustworthy structures. it's a key allowing know-how reaching the necessities for decreasing the scale and price on the process and product level.

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Extra resources for Microelectronics Packaging Handbook: Technology Drivers Part I

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The third part, "Subsystem Packaging," completes the coverage of the technology options available to the designer to form a system or a major subsystem. New chapters were added to address manufacturing considerations, electrical testing, polymers used in packaging, and optical packaging. Another aspect of packaging is microelectronics versus general electronics, in which a great deal of components are heavy and/or bulky, such as power-supply transformers, filter capacitors, cathode-ray-display tubes, and flat-panel displays.

This book, as its title indicates, concerns itself mainly with packaging of the wide range of microelectronic components. The next subsection of this chapter, "Packaged Electronics," highlights the two pivotal roles of the electronic packaging-the ability to support and preserve the on-chip performance, and the main limiting factors to such an ability. It also raises many questions triggered by these initial highlights to introduce the subsequent section on packaging definition, to describe its functions and hierarchy, and to give a brief overview of these books.

The structure shown MICROELECTRONICS PACKAGING-AN OVERVIEW 1-28 Figure 1-11. Causes of Reflected, Coupled, and Switching (M) Noises represents two short sections of typical wiring. Each signal line, in addition to its own resistance, capacitance to the reference (ground) plane, and self-inductance, has mutual inductance Ll2 and interline capacitance C l2 to its neighbor. When driver DI sends a changing signal voltage and current through the first signal line toward its terminating resistor T1, line 2 between D2 and T2 is supposed to be in a steady state, not switched.

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