Microelectronic packaging by M. Datta, Tetsuya Osaka, J. Walter Schultze

By M. Datta, Tetsuya Osaka, J. Walter Schultze

Microelectronic Packaging analyzes the big impression of electrochemical applied sciences on quite a few degrees of microelectronic packaging. often, interconnections inside of a chip have been thought of outdoors the world of packaging applied sciences, yet this ebook emphasizes the significance of chip wiring as a key point of microelectronic packaging, and specializes in electrochemical processing as an enabler of complicated chip metallization. Divided into 5 elements, the booklet starts by means of outlining the fundamentals of electrochemical processing, defining the microelectronic packaging hierarchy, and emphasizing the influence of electrochemical know-how on packaging. the second one half discusses chip metallization issues together with the advance of strong barrier layers and replacement metallization fabrics. half III explores key points of chip-package interconnect applied sciences, through half IV's research of programs, forums, and connectors which covers fabrics improvement, expertise developments in ceramic applications and multi-chip modules, and electroplated touch fabrics. Illustrating the significance of processing instruments in allowing expertise improvement, the e-book concludes with chapters on chemical mechanical planarization, electroplating, and rainy etching/cleaning instruments. specialists from undefined, universities, and nationwide laboratories submitted studies on every one of those topics, taking pictures the technological advances made in each one sector. a close exam of the way packaging responds to the demanding situations of Moore's legislation, this e-book serves as a well timed and necessary reference for microelectronic packaging and processing pros and different commercial technologists.

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95) was obtained in the range of 2 to 3 degrees. We also observe low tensile stress (in the range of 108 dyn/cm2) in electroplated Cu films. Strong 〈111〉 texture, large grains, and low stress in plated Cu will improve the reliability related attributes of Cu metallization such as electromigration and stress voiding. 19 We can also affect the grain structure and grain orientation by controlling the deposition conditions. 12). Grain sizes of electroplated copper increase further after low temperature annealing.

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