Microelectronics

MEMS mechanical sensors by Stephen Beeby; et al

By Stephen Beeby; et al

Show description

Read or Download MEMS mechanical sensors PDF

Best microelectronics books

Adhesion in Microelectronics

This entire e-book will offer either primary and utilized features of adhesion touching on microelectronics in one and simply available resource. one of the themes to be coated include;Various theories or mechanisms of adhesionSurface (physical or chemical) characterization of fabrics because it relates to adhesionSurface cleansing because it relates to adhesionWays to enhance adhesionUnraveling of interfacial interactions utilizing an array of pertinent techniquesCharacterization of interfaces / interphasesPolymer-polymer adhesionMetal-polymer adhesion  (metallized polymers)Polymer adhesion to numerous substratesAdhesion of skinny filmsAdhesion of underfillsAdhesion of molding compoundsAdhesion of other dielectric materialsDelamination and reliability matters in packaged devicesInterface mechanics and crack propagationAdhesion size of skinny motion pictures and coatings

Op Amps Design Application and Troubleshooting

OP Amps intentionally straddles that imaginary line among the technician and engineering worlds. themes are conscientiously addressed on 3 degrees: operational assessment, numerical research, and layout systems. Troubleshooting concepts are provided that depend upon the appliance of basic electronics rules.

Extra resources for MEMS mechanical sensors

Sample text

Another method is to deposit alternate layers of amorphous silicon at 570°C, which is tensile, and polysilicon at 615°C, which is compressive [4]. In surface micromachining, structures are generally released by wet etching the sacrificial layer followed by rinsing in water. This gives rise to capillary forces as the wafers are dried causing the structures to stick to the underlying substrate. Many methods for preventing this stiction have been developed. 15 Typical surface-micromachined structure: (a) oxide deposited and etched; (b) polysilicon deposited; (c) polysilicon patterned and etched to create access holes through to the oxide; and (d) oxide etched selectively in HF to leave freestanding polysilicon structures.

Pomerantz, “Field Assisted Glass-Metal Sealing,” J. Appl. , Vol. 40, 1969, pp. 3946–3949. , “Low Temperature Silicon-to-Silicon Anodic Bonding with Intermediate Low Melting Point Glass,” Sensors and Actuators, Vol. A23, 1990, pp. 931–934. , and M. Lindahl, “Si-to Si Wafer Bonding Using Evaporated Glass,” Transducers ’95, Chicago, IL, June 16–19, 1997, pp. 661–664. , “Anodic Bonding on Glass Layers Prepared by a Spin-On Glass Process: Preparation Process and Experimental Results,” Transducers ’01, Munich, Germany, June 10–14, 2001, pp.

231–239. , “Electrostatic Parallelogram Actuators,” Transducers ’91, San Francisco, CA, June 24–27, 1991, pp. 63–66. , D. Soane, and R. Howe, “Supercritical Carbon Dioxide Drying of Microstructures,” Transducers ’93, Yokahama, Japan, June 7–10, 1993, pp. 296–298. , “Dry Release for Surface Micromachining with HF Vapor-Phase Etching,” J. Microelectromech. , Vol. 6, 1997, pp. 226–233. , “A New Organic Modifier for Anti-Stiction,” J. Microelectromech. , Vol. 10, 2001, pp. 33–40. , “Dichlorodimethylsilane as an Anti-Stiction Monolayer for MEMS: A Comparison to the Octadecyltrichlosilane Self-Assembled Monolayer,” J.

Download PDF sample

Rated 4.09 of 5 – based on 31 votes