MEMS mechanical sensors by Stephen Beeby; et al

By Stephen Beeby; et al

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Another method is to deposit alternate layers of amorphous silicon at 570°C, which is tensile, and polysilicon at 615°C, which is compressive [4]. In surface micromachining, structures are generally released by wet etching the sacrificial layer followed by rinsing in water. This gives rise to capillary forces as the wafers are dried causing the structures to stick to the underlying substrate. Many methods for preventing this stiction have been developed. 15 Typical surface-micromachined structure: (a) oxide deposited and etched; (b) polysilicon deposited; (c) polysilicon patterned and etched to create access holes through to the oxide; and (d) oxide etched selectively in HF to leave freestanding polysilicon structures.

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