Microelectronics

Handbook of Thin Film Deposition Techniques by Krishna Seshan

By Krishna Seshan

Show description

Read or Download Handbook of Thin Film Deposition Techniques PDF

Similar microelectronics books

Adhesion in Microelectronics

This complete ebook will supply either basic and utilized facets of adhesion concerning microelectronics in one and simply available resource. one of the issues to be lined include;Various theories or mechanisms of adhesionSurface (physical or chemical) characterization of fabrics because it relates to adhesionSurface cleansing because it relates to adhesionWays to enhance adhesionUnraveling of interfacial interactions utilizing an array of pertinent techniquesCharacterization of interfaces / interphasesPolymer-polymer adhesionMetal-polymer adhesion  (metallized polymers)Polymer adhesion to numerous substratesAdhesion of skinny filmsAdhesion of underfillsAdhesion of molding compoundsAdhesion of alternative dielectric materialsDelamination and reliability concerns in packaged devicesInterface mechanics and crack propagationAdhesion size of skinny motion pictures and coatings

Op Amps Design Application and Troubleshooting

OP Amps intentionally straddles that imaginary line among the technician and engineering worlds. themes are rigorously addressed on 3 degrees: operational assessment, numerical research, and layout strategies. Troubleshooting thoughts are provided that depend on the appliance of basic electronics rules.

Additional resources for Handbook of Thin Film Deposition Techniques

Example text

Now microprocessors have closed the technology gap. DRAM focus is on minimization of area occupied by memory cells. To increase cell density the cell size must be as small as possible. In microprocessors, performance is dominated by the length of the transistor gate and by the number of interconnect layers. 1 Performance of Packaged Chips—Trends Performance increase follows the decrease in cell size: the transistor drives increase and switching times decrease because the charge being switched decreases.

It is for these reasons that low-pressure CVD is widely used in the highly cost-competitive semiconductor industry for depositing films of insulators, amorphous and polycrystalline silicon, refractory metals, and silicides. Epitaxial growth of silicon at reduced pressure minimizes autodoping (contamination of the substrate by its dopant), a major problem in atmospheric-pressure epitaxy. Vapor-Phase Epitaxy. Vapor-phase epitaxy (VPE)[46][47][51]–[55] and metal-organic chemical vapor deposition (MOCVD)[46][47][51]–[55] are used for growing epitaxial films of compound semiconductors in the fabrication of optoelectronic devices.

The prototype equipment for the development of new deposition processes can encompass a wide variety of designs and constructional details. Only the future outlook for the requirements and applications of such equipment is discussed in the following chapters in this book. The deposition equipment for the research and development of new device structures has to meet, in general, quite different requirements than the equipment used in the manufacturing of devices on a large scale.

Download PDF sample

Rated 4.50 of 5 – based on 8 votes