Microelectronics

Electrical Conductive Adhesives with Nanotechnologies by Yi (Grace) Li, Daniel Lu, C.P. Wong

By Yi (Grace) Li, Daniel Lu, C.P. Wong

Electrical Conductive Adhesives with Nanotechnologies starts off with an summary of digital packaging, discussing many of the electric adhesive recommendations at present to be had. The booklet focuses generally on Electrically Conductive Adhesives (ECAs), in addition to different adhesives resembling lead-free soldering, Isotropically Conductive Adhesives (ICAs), Anisotropically Conductive Adhesives/Films (ACA/ACFs) and Nonconductive Adhesives/Films (NCA/NCFs). The authors additionally current examples of the way conductive adhesives may be utilized to nano innovations, whereas making vital mentions of contemporary study and improvement breakthroughs within the fields.

Drawing upon tireless examine, years of theoretical improvement and useful adventure, and using a variety of visible examples and illustrative purposes, authors CP Wong, Yi Li and Daniel Lu hide electrically conductive adhesives intensive, whereas additionally describing:

  • The electric houses, thermal functionality, bonding strain, meeting and reliability of diverse varieties of electrically conductive adhesives
  • The similarities and alterations among lead-free soldering suggestions and electrically conductive adhesives, whereas additionally discussing the benefits of ECAs.
  • Insights into the way forward for nano ECAs, in addition to projections of destiny developments.

Electrical Conductive Adhesives with Nanotechnologies is a must-read for either researchers and lively engineers within the digital packaging box.

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Specifically, it has been suggested that future cooling approaches may be based on micro- and nanotechnologies. For thermal management applications, the distinctive properties of onedimensional structures and materials have gained much attention. Among such materials, carbon nanotubes (CNTs), due to their unique thermal properties, give rise to new opportunities in thermal management of microelectronic devices and ICs. Also, the extraordinary electrical and mechanical properties of CNTs make them a promising candidate for electrical interconnects [74, 75].

Carbon nanotubes are expected to offer a substantially higher resistance to electromigration than do copper lines. Thus, CNT connections between metallization layers may solve the problems of electromigration and heat removal. Researchers from Fujitsu and Infineon have investigated this area extensively [81–83]. In one approach, a hole is etched in the interlayer dielectric, and catalyst is deposited into the bottom of the hole; excess catalyst is removed from the top of the hole. Alternatively, a catalyst layer is deposited under the interlayer dielectric and is exposed by etching a hole in the dielectric.

L. F. A. T. White Paper: IPC-SPVC-WP-006 Round Robin Testing and Analysis, Silver, Copper, 12, “International Printed Circuit Association Solder Products Value Council,” White Paper: IPCSPVC-WP-006 Round Robin Testing and Analysis, Lead Free Alloys: Tin, Silver, Copper, 12, August 2003. M. Abtew and G. Selvaduray, “Lead-Free Solders in Microelectronics,” Materials Science and Engineering Report, 27(5–6), 95–141, 2000. C. M. L. Wu, M. L. Huang, J. K. L. Lai, and Y. C. Chan, “Developing a Lead-Free Solder Alloy Sn-Bi-Ag-Cu by Mechanical Alloying,” Journal of Electronic Materials, 29(8), pp.

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