Manufacturing

Cracking failures in lead-on-chip packages induced by chip

Read Online or Download Cracking failures in lead-on-chip packages induced by chip backside contamination :MASAZUMI AMAGAI, HIDEO SENO and KAZUYOSHI EBE. IEEE Transactions on Components, Packaging and Manufacturing Technology, Part B, 18(1), 119 (February 1995) PDF

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Extra info for Cracking failures in lead-on-chip packages induced by chip backside contamination :MASAZUMI AMAGAI, HIDEO SENO and KAZUYOSHI EBE. IEEE Transactions on Components, Packaging and Manufacturing Technology, Part B, 18(1), 119 (February 1995)

Example text

1 can be expressed as: uθ (r ) = AK1 ( sr ) + BI1 ( sr ) . (9) where, I1 ( sr ) and K1 ( sr ) are the modified Bessel functions of the first kind and second kind of the fisrt order; A and B can be obtained from the boundary conditions. 5. 1 can be written as: uθ (r ) = AK1 ( sr ) . 10 can be expressed as: τ rθ = Gs ( ∂uθ uθ − ) = − AGs sK 2 ( sr ) . 4 yields: φ2 ( z ) = C1 cos(γ z ) + C2 sin(γ z ) .  ρ pω 2 where, γ =   Gp − 4sK 2 ( sr0 )   µr0 K1 ( sr0 )  (12) 1/ 2 ; µ = Gp / Gs ; C1 and C2 are the coefficients determined from the boundary conditions.

Among them, soil condition, drainage condition and static condition belong to an internal cause, and dynamic condition belongs to an external cause. As can be seen from Figure 1, there are many influence factors of foundation liquefaction, of which the influence on foundation liquefaction has highly nonlinear characteristics. Various influence factors of sand liquefaction should be comprehensively considered as far as possible, and an appropriate discrimination method is proposed, in favor of improving the accuracy of evaluation.

ECAP strong shear thinning effect of SiCp/Al matrix composite powder material impact on distribution and density were significantly[17]. The ultra-high strength aluminum alloy matrix composites 7090/SiCp[18] using ECAP processing Bc path, after four passes of ECAP processing, the composite grains gradually been refined , the third after the second grain size to 1 μ m or less, SiC particles under the effect of a large shearing force to be broken refined, distributed in the matrix is more uniform.

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